Hi Paul, 3/4"Cu takes a bit of heat on a solder slip joint and I find useful for gauging btu's needed for gas welding exspecially if your using silver solder. You are correct on soldering with 50/50 and I should have explained myself. Gas welding CU with act/oxy gives a very good joint without CU splatter, inside or out. I feel it gives best solder suck-back control. Over heating of any metal will cause it to oxidize and or splatter. On a refrigeration CU joint, we purge the pipes with nitrogen or Co2 to keep oxides non-existant as they will plug the orifice on the exspansion valves. Acid is also not used on the CU joints for the same reason. I also weld a fare amount of very thin gold and silver and act/oxy works very well for this application. I do have a special torch that I use, about 4" long with mixing chamber and tip included for very easy torch control usally wearing 4X magnifier visor. This torch looks just like any other torch other than being much smaller and using 1/8" cloth covered rubber hose. Here again LP/oxy has too much of a heat zone to be effective. Aluminum gas welding is another area where oxy/act excels over LP/oxy as it just doesn't have the BTU's required for gas welding aluminum. When I was a kid, my neighbor had a old acetylene generator that used carbide and water to make acetylene. I sure would like to locate one of those. T_Bone
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